LASeRpapers - recent
papers of the Laser group
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Laser
removal of oxides and particles from copper surfaces
for microelectronic fabrication
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Opt
Express 2000; 7(2): 68}76. http://www.opticsexpress.org/oearchive/source/22798.htm.
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J.
M. Lee and K. G. Watkins
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Laser
Group, Department of Engineering, University of Liverpool
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Brownlow Street, Liverpool L69 3GH, UK
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Abstract:
Laser
removal of surface oxides and small particles from copper
surfaces was carried out using a Q-switched Nd:YAG laser.
Oxide layers and small particles on copper surfaces
should be removed for the improvement of solder quality
on printed circuit boards (PCBs) and for the prevention
of circuit failure or loss of production yield during
the fabrication of microelectronic devices. A selective
removal of surface oxides from a copper surface was
achieved by the laser treatment, which was confirmed
by on-line acoustic monitoring of the process. An angular
laser cleaning technique in which the laser irradiates
the surface at a glancing angle was used for effective
removal of the particles from the surface. The unique
characteristics of this technique and the cleaning mechanism
are discussed. . 2000 Optical Society of America
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